Expanded Ultra C Tahoe platform targets advanced-node wet processing
ACM Research expanded its Ultra C Tahoe system into a multi-process wet processing platform for advanced logic and memory manufacturing.
The platform combines batch and single-wafer wet processes in one architecture, aiming to cut wafer transfers, shorten cycle times and improve throughput.
Multiple leading chipmakers have adopted the expanded platform, signaling production readiness for advanced-node wet processing.
Added monitor-wafer reclaim capability is now running in volume production, consolidating film removal, cleaning and drying on one tool.
The company cited up to 75% lower sulfuric acid use, targeting cost reduction and lower chemical waste.
ACMR•
