AI demand drives shift to panel-level packaging, ACM Research says
ACMR•ACMR•ACMR•ACMR•ACM Research says AI-driven demand for high-performance computing is spurring adoption of panel-level packaging amid packaging shortages. TSMC's roadmap projects package sizes growing from 5.5 reticles today to 14 by 2029.
ACM Research's analysis identifies AI-driven demand for high-performance computing as a catalyst for panel-level packaging adoption amid packaging shortages. Current round substrates accommodate about 30 to 35 packaged dies, limiting production capacity for increasingly large packages.
Square panels offer greater throughput, potentially higher yields and improved system performance through more effective chip integration. Adoption faces equipment shortages, processes requiring optimization and a lack of standard panel sizes, complicating equipment makers' development priorities.
