Applied Materials and Intel collaborate on AI chipmaking technology
AMAT•Applied Materials and Intel are collaborating to speed development of chipmaking technology for AI-driven computing, spanning next-generation transistors, interconnect scaling and advanced packaging.
1. Joint research effort
Research and development will be coordinated between Applied Materials’ EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon. The collaboration includes advanced packaging for Intel’s Foveros-based 3D stacking, and the EPIC Center is scheduled to be operationally ready this year.
