ASML Ships $400M High-NA EUV Tools and Targets Advanced Chip Packaging
ASML has begun shipping its $400 million High-NA EUV systems with 80% uptime, 500,000 wafers processed and a roadmap to 1,500 watt light-source power for 330 wafers per hour by 2030. The company is expanding into advanced packaging and next-generation lithography, exploring chip-size scaling and deploying AI after appointing Marco Pieters as CTO.
1. High-NA EUV Rollout
ASML has moved its High-NA EUV lithography systems into mass production at a $400 million price point. To date, the machines have processed 500,000 silicon wafers with 80% average uptime, and chipmakers are expected to require two to three years of testing before full factory integration.
2. Light-Source and Throughput Enhancements
The new EUV tools feature an improved light source capable of generating 1,000 watts under customer conditions, with a clear development path to 1,500 watts and potential for 2,000 watts. These upgrades aim to boost wafer output from roughly 220 per hour today to about 330 per hour by the end of the decade.
3. Advanced Packaging Strategy and Leadership
Under newly appointed CTO Marco Pieters and a restructured technology unit, ASML is expanding beyond lithography into advanced chip packaging, bonding and multi-chip integration. The company is also researching next-generation and third-generation lithography platforms and exploring methods to scale chip dimensions for higher processing speeds.