ASML’s EUV Upgrade Hits 200 WPH, Enables Sub-3nm Chips Next Year
ASML introduced an EUV lithography upgrade that boosts wafer throughput to over 200 wafers per hour and delivers sub-3nm resolution, further widening its lead over Nikon and Canon. Pilot trials are set to begin this year with full production ramp scheduled for 2026 to support next-generation chip nodes.
1. Technical Details
ASML’s new EUV enhancement increases source power and optics performance to achieve over 200 wafers per hour throughput while refining patterning precision down to sub-3nm nodes. The upgrade represents a major step beyond its existing NXE:3800C series in both speed and resolution.
2. Strategic Implications
By extending its technological lead, ASML is poised to capture the next wave of tool orders from major foundries such as TSMC, Samsung and Intel. The gap leaves Nikon and Canon struggling to match throughput and resolution, reinforcing ASML’s dominance in advanced lithography for 2026 and beyond.