Astera Labs Opens Tel Aviv and Haifa Design Center for Next-Gen AI Fabric R&D
Astera Labs has opened an advanced R&D design center in Tel Aviv and Haifa, Israel to accelerate development of next-generation scale-up AI connectivity fabrics addressing critical memory bottlenecks. Industry veterans Guy Azrad and Ido Bukspan will lead operations and ASIC engineering to drive high-bandwidth rack-scale AI solutions.
1. Israel Design Center Launch
Astera Labs has established a new design center with offices in Tel Aviv and Haifa, creating an end-to-end facility dedicated to advanced research and development of high-bandwidth AI connectivity solutions. The center will focus on next-generation scale-up fabrics and protocols aimed at resolving data, network and memory bottlenecks in AI training and inference.
2. Leadership Team
Guy Azrad, former Google VP of chip design engineering, has been appointed senior vice president of engineering and general manager of the Israel operations. He will be supported by Ido Bukspan, ex-NVIDIA and Pliops senior leader, as vice president of ASIC engineering, bringing deep expertise in networking SoCs and data-center acceleration.
3. R&D and Collaboration
The Israel center will cover the full chip design flow from architecture through silicon production, integrating hardware, software and system design for emerging AI fabrics. It will collaborate with leading Israeli universities and venture partners to accelerate innovations in CXL, NVLink Fusion, PCIe and other connectivity technologies.
4. Strategic Expansion Impact
This strategic investment expands Astera Labs’ global engineering footprint within one of the world’s premier semiconductor ecosystems. The new center is expected to enhance the company’s ability to support rack-scale AI infrastructure growth and drive its Intelligent Connectivity Platform adoption worldwide.