Avnet’s Hackster partners with Autodesk, Arduino, Qualcomm, PCBWay on AU 2027 product design challenge - AVT News | RalliesAvnet’s Hackster partners with Autodesk, Arduino, Qualcomm, PCBWay on AU 2027 product design challenge
A
AVT• Avnet’s Hackster launches Autodesk University 2027 design competition
- Avnet’s Hackster.io partnered with Autodesk, Arduino, Qualcomm, and PCBWay to launch an Autodesk University 2027 product design competition.
- The winning device is to be manufactured and distributed to about 750 Autodesk University 2027 attendees.
- The contest centers on connected-device concepts built with Autodesk Fusion, Arduino UNO Q, and PCBWay-backed prototyping support.
•
