BE Semiconductor Industries reported third-quarter orders of €342.6 million, up 96% year over year and above analyst expectations, and said orders for hybrid bonding systems more than doubled this year compared with all of 2025. It announced a €100 million share buyback and expects fourth-quarter revenue to be broadly unchanged from the third quarter, plus or minus 5%.
BE Semiconductor Industries reported third-quarter order intake of €342.6 million, up 17% from the second quarter and 96% from a year earlier. Analysts had expected €298 million. The company said strong demand from AI data centers drove orders and announced a new €100 million share buyback to begin October 27.
CEO Richard Blickman said Besi does not view ASML as a competitor in hybrid bonding and said the companies are working together to improve the precision with which Besi’s machines place chips. Besi said orders for its hybrid bonding systems have more than doubled this year compared with all of 2025. Blickman said that, to his knowledge, ASML was interested in 3D transistor stacking inside chips over the next decade, not competing with Besi.
Besi expects fourth-quarter revenue to be broadly unchanged from third-quarter revenue of €283.4 million, give or take 5%. The company said some customers asked to time deliveries of third-quarter orders with production plans for the first half of 2027.
