Broadcom Secures Over $30 B Custom-Chip Pact with Apple Through 2031
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AVGO•Broadcom and Apple extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion. The deal reinforces Broadcom's role as a critical supplier for Apple's server chips and secures long-term revenue visibility.
Broadcom and Apple have extended their custom ASIC chip partnership through 2031, with contract commitments projected to exceed US$30 billion. The agreement covers design, development and supply of specialized server chips, ensuring Broadcom remains a primary component provider for Apple’s data center infrastructure.
The extended pact secures a significant recurring revenue stream for Broadcom over the next five years, enhancing revenue visibility and margins. It deepens integration with Apple's product roadmap, potentially deterring competitors and reinforcing Broadcom’s market position in high-performance server chips.