Cadence launches Arm and Samsung Foundry chiplet ecosystem to accelerate AI designs
Cadence has launched a spec-to-packaged chiplet ecosystem in collaboration with Arm and Samsung Foundry to reduce integration risk and accelerate AI, data center, and HPC design workflows. The initiative standardizes interfaces and design flows to shorten development cycles and enhance adoption of Physical AI solutions.
1. Cadence Launches Spec-to-Packaged Chiplet Ecosystem
Cadence Design Systems has introduced a new spec-driven chiplet ecosystem in collaboration with Arm and Samsung Foundry, designed to reduce integration risk by up to 30% and accelerate time-to-market for AI, data center and high-performance computing designs. The platform supports both 2.5D and 3D package-on-package configurations and leverages standardized interface specs to streamline verification, physical implementation and thermal analysis. Early adopters report as much as a 40% reduction in cross-team design iterations, while development cycles for advanced networking accelerators have shortened by an average of three months.
2. Cadence Schedules Fiscal Q4 2025 Earnings Webcast
Cadence will host its fourth quarter and full fiscal year 2025 financial results webcast on February 17, 2026, at 2:00 p.m. Pacific Time, featuring remarks by CEO Dr. Anirudh Devgan and CFO John Wall. The live presentation will cover key revenue drivers, including growth in cloud-to-edge AI tooling and digital-twin software, and provide updated guidance for fiscal 2026. An archived webcast will be accessible from 5:00 p.m. Pacific Time on February 17 through 5:00 p.m. Pacific Time on March 16, 2026, via the company’s investor portal. In 2024, Cadence was named one of the Wall Street Journal’s top 100 best-managed companies, underscoring its operational strength as it enters the new fiscal year.