Celestica to Manufacture AMD Helios AI Switches for Instinct MI450 Deployment in Late 2026
Celestica will lead R&D, design and manufacturing of scale-up networking switches for AMD’s Helios rack-scale AI platform, leveraging Open Compute Project’s ORW form factor and Ultra Accelerator Link over Ethernet architecture. The switches will interconnect next-generation AMD Instinct MI450 GPUs and hit market in late 2026.
1. Strategic Collaboration with AMD
Celestica and AMD formed a strategic collaboration to bring the Helios rack-scale AI platform to market, combining AMD’s high-performance AI computing with Celestica’s data center infrastructure expertise.
2. Celestica’s R&D and Manufacturing Role
Under the agreement, Celestica will lead R&D, design, and manufacturing of scale-up networking switches based on the Open Compute Project ORW form factor and Ultra Accelerator Link over Ethernet architecture.
3. Technical Specifications of Helios Switches
The networking switches are engineered to provide high-speed interconnectivity for AMD Instinct MI450 GPUs, optimizing large-scale AI clusters with advanced silicon for low-latency data transfer.
4. Market Launch and Growth Outlook
AMD Helios and its associated switches are slated for customer availability in late 2026, positioning Celestica to capitalize on growing demand for AI infrastructure and potentially boosting its data center hardware revenues.