Chinese Chip Executives Propose 2026-30 Plan to Build Domestic ASML-Style EUV System
Chinese semiconductor leaders urge a national 2026-2030 program to develop domestically integrated EUV lithography systems matching ASML’s 100,000-component machines supplied by 5,000 vendors. They identified critical EDA software, silicon wafer and gas material gaps requiring centralized funding and human resource coordination under China’s 15th Five-Year Plan.
1. National Integration Initiative
Three top semiconductor chairmen and leading institutes called for a coordinated national program running from 2026 to 2030 to pool resources, funding and talent toward building a homegrown EUV lithography system comparable to ASML’s 100,000-component machines.
2. Technical and Material Gaps
China’s institutions have made advances in EUV laser sources, wafer stages and optical systems, but struggle to integrate these into a complete machine; executives highlighted bottlenecks in EDA software, silicon wafers and specialty electronic gases requiring central planning.
3. Policy and Implementation Plans
The call urges relevant departments to draft implementation plans under the 15th Five-Year Plan, emphasizing uniform allocation of funds and human resources to overcome supplier fragmentation across 5,000 component vendors and break existing fame and fortune barriers.