Cisco Debuts G300 Chip with 102.4Tbps Capacity and 28% Faster AI Workloads
Cisco launched its new Silicon One G300 chip for AI data centers, offering 102.4 Tbps switching capacity, 33% higher network utilization and 28% faster job completion. It also unveiled G300-powered N9000 and 8000 systems with liquid cooling that boosts bandwidth density and cuts energy use by nearly 70%.
1. Cisco launches Silicon One G300 chip
At Cisco Live EMEA, Cisco introduced the Silicon One G300, a high-performance switching silicon with 102.4 Tbps capacity, designed to power massive AI clusters with 33% increased network utilization and 28% faster job completion times.
2. G300-powered systems and optics drive efficiency
Cisco unveiled new N9000 and 8000 systems powered by the G300, featuring liquid cooling technology that improves energy efficiency by nearly 70%, along with 1.6T OSFP and 800G linear pluggable optics that reduce power consumption while scaling AI connectivity.
3. Analyst outlook highlights $4bn AI order target
Following its fiscal first-quarter earnings release, JPMorgan highlighted Cisco’s fiscal 2026 guidance for hyperscaler AI orders exceeding $4 billion and a $2 billion AI opportunity pipeline, suggesting potential upside if AI infrastructure adoption accelerates.