Coherent demonstrates 6” VCSEL quantum entropy source and launches bondable diamond reducing interface resistance by 99%
Coherent and Quside successfully demonstrated a mass-manufacturable quantum entropy source using 6” VCSELs with runtime entropy verification suitable for cryptographic key generation and quantum-safe systems. Coherent launched bondable diamond thermal management solutions that cut interface resistance by up to 99% and support direct die bonding on 100 mm square substrates.
1. Mass-Manufacturable Quantum Entropy Source Demonstration
Coherent Corp. and Quside have achieved the first large-scale deployment of a quantum entropy generator using Coherent’s 6″ VCSEL platform and Quside’s quantum random number technology. In laboratory trials they produced over 10 gigabits of verifiable entropy per second, with runtime verification ensuring each bit meets NIST SP 800-90B statistical requirements. The integrated module, fabricated on standard semiconductor lines, showed error rates below 1×10⁻⁶ and sustained operation over 1,000 hours without performance degradation. This breakthrough paves the way for embedding quantum-grade key material directly into secure elements, processors and hardware roots of trust at volumes exceeding 100,000 units per wafer run.
2. Introduction of Bondable Diamond Thermal Management Solutions
On Jan. 19, Coherent unveiled its new bondable diamond products engineered for direct fusion-bonding to semiconductor dice up to 100 mm². By controlling surface roughness to within 0.2 nm RMS and flatness to 0.5 μm TIR, these substrates cut thermal interface resistance by up to 99% compared with conventional TIMs. In thermal cycling tests over –40 °C to 125 °C for 5,000 cycles, devices with Coherent’s diamond spreaders maintained junction temperatures 25 °C lower under 200 W/cm² heat flux. The vertical integration of diamond growth, precision finishing and coating enables yields above 90% on production lines, targeting deployment in high-power GaN RF modules, silicon carbide power switches and advanced photonic engines.