Coherent Corp. presented its full spectrum of photonics technologies at SPIE Photonics West in San Francisco from January 20–22, 2026. The company demonstrated continuous-wave and ultrafast lasers, beam delivery modules, advanced materials and thermal management systems designed for AI datacenters, semiconductor and display capital equipment, life sciences, precision manufacturing and scientific research. Live demos included a thermo-electric generator converting waste heat into usable power for data centers and a Deep-UV film-cutting solution combining a 266 nm picosecond laser with precision optics. Executives, including CMO Dr. Sanjai Parthasarathi, led sessions on co-packaged optics for next-generation data infrastructure, while technical presentations covered > 50%-efficient thulium-doped fiber lasers and potassium terbium fluoride crystals for magneto-optics. The showcase underlines Coherent’s diversified revenue opportunities across high-growth end markets.

In collaboration with Quside, Coherent achieved a breakthrough in hardware-based security by demonstrating a mass-manufacturable quantum entropy source at Photonics West 2026. The solution integrates Coherent’s vertical-cavity surface-emitting lasers fabricated on 6" wafers with Quside’s quantum random-number generation technology, delivering real-time entropy verification suitable for cryptographic key generation and quantum-safe architectures. Testing confirmed that runtime entropy from a single VCSEL meets industry standards for high-quality randomness, enabling secure deployments in processors, secure elements and hardware roots of trust. Coherent and Quside will offer development kits for system-level integration, positioning both firms to capture market share in the emerging $2 billion quantum security segment.

Coherent launched its bondable diamond thermal spreaders engineered with precision surface finishes and coatings to enable direct fusion, hybrid or metallic bonding to semiconductor die up to 100 mm square. By reducing thermal interface resistance by as much as 99% compared with conventional thermal interface materials, these solutions significantly boost cooling performance for silicon, silicon carbide, gallium nitride and other substrates. Leveraging production-scale diamond growth since 2010 and in-house surface-finishing expertise, Coherent can deliver high-yield components with features such as embedded vias and optical structures. Senior VP Steve Rummel highlighted partnerships with leading chip manufacturers to customize diamond and ceramic hybrid assemblies, underscoring Coherent’s potential to expand its engineered materials business in high-margin thermal management applications.