GlobalFoundries to make key AI chip component for TSMC
GFS•GlobalFoundries said it will make silicon interposers for TSMC at its Malta, New York, facility under a five-year agreement. Volume production is expected to ramp up in the first half of 2028.
1. Five-year agreement
GlobalFoundries will expand manufacturing capacity at its Malta, New York, facility to produce silicon interposers for TSMC. The component sits beneath processors and memory chips in advanced AI packages and enables them to communicate at high speeds.
2. Production timeline
The company said the facility is expected to become the first U.S.-based source of silicon interposers used in advanced chip-packaging technologies. Volume production is expected to begin ramping up in the first half of 2028, as demand for advanced packaging exceeds available manufacturing capacity.
