IBM partners with Siemens to advance nanostack chip architecture research
IBM•IBM and Siemens entered a research collaboration to advance IBM’s nanostack transistor architecture toward manufacturing readiness, targeting design, simulation and lithography techniques beyond the current 7-angstrom node.
1. Research collaboration
The work includes building virtual nanostack models to optimize performance, refine designs and identify fabrication issues before chips are built. The architecture vertically stacks nanosheet transistors and targets nearly 100 billion transistors in a fingernail-sized area at 7 angstrom.
