Innoviz Partners with Vueron for AI LiDAR Annotation, Unveils 60% Smaller InnovizThree Sensor
Innoviz signed an MOU with Vueron to integrate InnovizTwo LiDAR data into Vueron's cloud-based VueX platform for automated annotation and AI training, demonstrating the solution at CES 2026. It also unveiled InnovizThree, a sensor-fusion LiDAR and RGB camera 60% smaller than InnovizTwo, simplifying OEM integration for automotive, drones and robotics.
1. Innoviz and Vueron Forge AI Annotation Partnership
Innoviz Technologies has signed a memorandum of understanding with Vueron Technology to integrate InnovizTwo LiDAR data into Vueron's VueX AI development platform via a cloud-based environment. Under the agreement, users can upload raw point-cloud data from InnovizTwo and InnovizSMART sensors directly to the VueX platform, where advanced AI tools automatically generate bounding boxes and object classifications. This automated workflow cuts manual labeling time by up to 70%, while maintaining sub-centimeter annotation accuracy required for safety-critical automotive and smart-infrastructure applications. The joint solution builds on the companies’ earlier collaboration with InnovizOne sensors, and was showcased live at CES 2026 (Vueron booth LVCC West Hall #3569), underlining its readiness for real-world deployment in production pipelines.
2. InnovizUnveils Compact Colored 3D LiDAR-Camera Module
Innoviz has introduced InnovizThree, the industry’s first sensor-fusion module combining long-range LiDAR and an RGB camera in a package 60% smaller than its predecessor. The factory-aligned design ensures consistent visual-to-LiDAR geometry across production units, and hardware synchronization eliminates per-vehicle calibration, reducing OEM integration effort by 40%. Targeted at behind-windshield automotive systems, as well as drones, micro-robotics and humanoid platforms, InnovizThree delivers fully colored 3D point clouds through a single interface, minimizing wiring complexity and validation cycles. The company estimates that this integrated solution can cut system-level packaging costs by 25% and accelerate time-to-production by three months for global OEM customers.