Intel, 3DGS to Invest $3.3B in Odisha Substrate Plant, Creating 1,800 Jobs
INTC•Intel and 3DGS will invest $3.3 billion to build a semiconductor substrate plant in Odisha, India, over the next five to six years, backed by billions in Indian government subsidies. The plant will produce advanced packaging glass core and high-density interconnect substrates and create over 1,800 high-skilled jobs.
1. Investment Plans
Intel and 3DGS will commit $3.3 billion to build a substrate manufacturing plant in the Bhubaneswar-Khurda region of Odisha, phased over the next five to six years to align with projected demand growth and government incentives.
2. Production Focus
The facility will focus on advanced packaging glass core substrates and high-density interconnect substrates, essential components for next-generation processors and AI accelerators.
3. Job Creation and Subsidies
New Delhi has pledged billions in subsidies to support the project, which is expected to generate more than 1,800 direct high-skilled jobs in semiconductor manufacturing and related fields.
4. Strategic Implications
The plant strengthens Intel’s presence in India’s semiconductor ecosystem, diversifies its global supply chain and supports long-term capacity for advanced packaging technologies.
