At its CES 2026 launch event in Las Vegas, Intel introduced the Core Ultra Series 3 family, featuring three new models built on a 7-nanometer process node. The flagship Ultra 9 chip boasts up to 16 performance cores and 32 efficiency cores, delivering a 25% single‐thread performance gain and 30% improved multi‐thread throughput compared with the prior generation. Intel highlighted up to 40% better AI inference capabilities, driven by the integrated Neural Processing Unit (NPU) capable of 40 TOPS (trillion operations per second). The company also emphasized battery life improvements of up to 20% in ultrathin laptops and support for hardware-accelerated ray tracing in portable systems. Availability is scheduled for Q2 2026, with OEMs already announcing designs from Dell, HP and Lenovo.

Kevin Simpson, founder and chief investment officer of Capital Wealth Planning, disclosed on CNBC’s “Halftime Report” that he has recently added Intel to his core equity sleeve, alongside a new position in aerospace names. Simpson cited Intel’s strengthened production roadmap and the upcoming ramp of its 7-nanometer fabs in Arizona as key drivers. He noted that Intel has secured more than 50 design wins with major PC and data‐center customers for the Ultra Series 3 chips, and that excess manufacturing capacity should support margin expansion into 2027. This move reflects growing confidence in Intel’s ability to regain competitive share against rival chipmakers in both consumer and enterprise segments.