Intel and Lens Technology to develop glass substrate packaging
Intel entered a strategic collaboration with Lens Technology to develop glass substrate-based advanced semiconductor packaging for AI-era computing platforms.
Work targets higher performance, denser interconnects, and improved power efficiency for future systems serving AI, data centers, and specialized computing.
The partnership focuses on scaling manufacturing processes for advanced packaging, leveraging Intel packaging expertise, Lens precision glass processing, laser manufacturing, and high-volume production.
The companies also flagged potential cooperation on components for AI PCs, structural and thermal solutions for servers, and hardware platforms for robotics and edge computing.
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