Lightwave Logic Launches PDK 1.1 with Wafer-Level Testing and H2 2026 Foundry Transfer
Lightwave Logic released Version 1.1 of its backend-of-line Process Design Kit featuring enhanced BEOL process integration, wafer-level poling and testing, and Generation 4 encapsulation for improved manufacturability and environmental stability. The company has initiated transfer of the PDK to a high-volume semiconductor foundry, with majority integration expected in the second half of 2026.
1. PDK 1.1 Technical Enhancements
Version 1.1 of Lightwave Logic’s backend-of-line Process Design Kit incorporates refined BEOL process integration for improved manufacturability and device consistency. New wafer-level poling and testing capabilities streamline device processing, while Generation 4 encapsulation enhances environmental stability and long-term reliability.
2. Foundry Transfer Timeline
Lightwave Logic has commenced the transfer of PDK 1.1 to a high-volume semiconductor foundry, aiming to complete the majority of integration work during the second half of 2026. This move aligns the PDK with standard foundry production methodologies and prepares the platform for large-scale manufacturing.
3. Commercialization Outlook
The updated PDK underpins the company’s commercialization strategy by enabling partners to design and fabricate photonic integrated circuits using its high-performance electro-optic polymers. Ongoing collaboration with ecosystem partners and foundries is expected to accelerate adoption of low-power, high-speed optical interconnect solutions.