MACOM Unveils AlGaAs Hot Via Process with 60-110 GHz SP2T Switch
MTSI•MACOM’s chip‐scale hot via process uses AlGaAs diodes to eliminate wire bonds, routing RF and ground paths vertically through the die to cut assembly complexity and parasitics for mmWave use. Its first MASW-011261 SP2T switch operates from 60 to 110 GHz with 0.9 dB insertion loss, 30 dB isolation and sub-20 ns switching.
1. Process Overview
MACOM introduced a chip‐scale hot via process built on its AlGaAs diode technology that routes RF and ground paths vertically through the die, eliminating traditional wire bonds and copper pillar attachments.
2. Performance Advantages
By removing bond wires and reducing assembly steps, the hot via process cuts parasitics, improves manufacturing consistency and boosts signal integrity for millimeter wave frequencies.
3. MASW-011261 SP2T Switch
The first product using this process, the MASW-011261 switch, covers 60 to 110 GHz with typical insertion loss of 0.9 dB, 30 dB isolation, sub-20 ns switching speeds and a compact 1.87 mm x 1.98 mm package.
4. Exhibition at IMS 2026
MACOM will display the hot via technology and MASW-011261 SP2T switch at the International Microwave Symposium in Boston from June 9 to 11, 2026.
