Manz Asia, SUSS partner to advance semiconductor inkjet technology for advanced packaging

SOXX•2026-09-03

Focus on panel-level packaging

The partnership targets panel-level packaging, aiming to speed inkjet adoption in high-volume production through joint application, material, and process development.

Companies' respective contributions

Manz Asia contributes inkjet platforms and manufacturing engineering; SUSS provides semiconductor process expertise and global customer access.

Strategic collaboration for inkjet tools

Manz Asia agreed a strategic collaboration with SUSS to develop next-generation inkjet tools for semiconductor manufacturing and advanced packaging.

Manz Asia, SUSS partner to advance semiconductor inkjet technology for advanced packaging

Focus on panel-level packaging

Companies' respective contributions

Strategic collaboration for inkjet tools

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