Meta Unveils MTIA 300-500 AI Chips, AMD’s Su Seeks Samsung HBM Supply
Meta introduced four in-house MTIA AI chips (300, 400, 450, 500) for ranking, inference and generative workloads, with full deployment by 2027, posing a headwind to AMD’s data-center GPU sales. AMD CEO Lisa Su will meet Samsung’s Jay Y. Lee on March 18 to secure high-bandwidth memory and NAND supplies for AI accelerators.
1. Meta Debuts Four MTIA AI Chips
Meta has introduced four MTIA processors—the MTIA 300, MTIA 400, MTIA 450 and MTIA 500—designed for ranking, recommendation and high-end generative AI workloads. The MTIA 400 supports rack-scale configurations of up to 72 chips and claims raw performance competitive with leading commercial GPUs. Meta plans to deploy all four variants by 2026–2027, reducing its reliance on third-party GPU vendors like AMD.
2. Lisa Su to Secure Samsung Memory Supplies
AMD CEO Lisa Su will travel to South Korea on March 18 to meet Samsung Electronics Chairman Jay Y. Lee to negotiate high-bandwidth memory (HBM), DRAM and NAND supply agreements. The discussions will also explore collaboration with Naver on expanding semiconductor capacity, building sovereign AI infrastructure and developing next-generation computing technologies.