Microchip Technology has introduced the MCPF1525, a fully integrated power module featuring a 16V Vin buck converter capable of 25A per module and stackable up to 200A, designed specifically for next-generation AI and high-performance computing servers. Packaged in a vertical construction measuring just 6.8 mm x 7.65 mm x 3.82 mm, the module offers up to a 40% board‐area reduction compared with competing solutions. Onboard PMBus™ and I2C controls enable programmable monitoring and configuration, while embedded diagnostics report over‐temperature, over‐current and over‐voltage events to enhance reliability. The thermally enhanced package supports junction temperatures from –40 °C to +125 °C, and an integrated EEPROM allows designers to set default power-up parameters for seamless system integration.

The MCPF1525 is available now at a unit price of $12.00 in 1,000‐unit quantities through Microchip’s direct channels and authorized distributors worldwide. With AI server deployments driving demand for higher power density in constrained rack spaces, this module strengthens Microchip’s industrial and data center product portfolio. Investors should note the company’s recent fiscal Q3 revenue outlook update to approximately $1.185 billion, exceeding prior guidance of $1.109–$1.149 billion, reflecting robust order flows. Coupled with Microchip’s ongoing gross-margin expansion efforts and synergies across its PCIe® Switchtec™, FPGA, MPU and NVMe® controller lines, the MCPF1525 launch underscores the firm’s potential to capture incremental market share in high-growth computing segments.