Microchip Unveils BZPACK mSiC Modules Exceeding 1,000-Hour HV-H3TRB Standard
Microchip Technology has launched BZPACK mSiC power modules tested to exceed the 1,000-hour HV-H3TRB standard, offering CTI 600V cases and stable Rds(on) across temperature ranges. Available in half-bridge, full-bridge, three-phase and PIM/CIB topologies with baseplate-less design and press-fit terminals, the modules target industrial and renewable energy applications requiring high humidity, voltage and temperature reliability.
1. Product Launch and Positioning
Microchip Technology has introduced the BZPACK mSiC power modules to address demanding power-conversion environments in industrial and renewable energy markets. By leveraging its MB and MC mSiC MOSFET families, the company aims to simplify system integration and improve long-term reliability for customers.
2. Advanced Reliability and Testing
These modules are tested to exceed the 1,000-hour HV-H3TRB standard and feature a CTI 600V case, ensuring superior insulation against moisture-induced leakage. Stable Rds(on) performance across broad temperature ranges and substrate options of Aluminum Oxide or Aluminum Nitride further enhance durability.
3. Flexible Topologies and Design Features
BZPACK modules come in half-bridge, full-bridge, three-phase and PIM/CIB configurations, allowing designers to optimize performance and cost. The compact, baseplate-less design with press-fit, solderless terminals and optional thermal interface material enables faster assembly and consistent manufacturing.
4. Market Impact and Availability
Targeted at high-humidity, high-voltage, high-temperature applications, these modules support industrial drives and renewable energy systems. BZPACK mSiC power modules are now available in production quantities through Microchip’s direct sales channels and distribution partners.