Nanya Technology to build 3D wafer packaging, testing fab in Pingtung Science Park
SMH•Nanya Technology will build a 3D wafer packaging and testing fab in Pingtung Science Park after clearance from Taiwan’s NSTC. The plant will add TSV-based 3D IC capability to support demand for high-performance, high-bandwidth memory tied to AI applications.
1. New fab plans
Nanya Technology will build a 3D wafer packaging and testing fab in Pingtung Science Park after receiving clearance from Taiwan’s NSTC. The plant will add through-silicon-via-based 3D IC capability, targeting wafer stacking for integrated packaging and testing.
2. AI-related demand
The project aims to support demand for high-performance, high-bandwidth memory tied to the rapid expansion of AI applications.
