nVent partners with AMD to add rack-level cooling to Helios AI platform
NVT•nVent Electric is collaborating with AMD to develop rack-level cooling for AMD’s Helios Rackscale AI platform. The companies plan to show an initial look at the open-source solution at the OCP Global Summit in San Jose, Oct. 12-16, 2026.
1. Cooling collaboration
nVent Electric will add its rear-door heat exchanger cooling to the Helios platform to support high-density AI deployments. Its DC-powered dual rear-door unit targets the double-wide Helios rack and is designed to capture residual heat from liquid cooling.
