nVent partners with AMD to add rack-level cooling to Helios AI platform

AMD•2026-10-13

nVent Electric is collaborating with AMD to develop rack-level cooling for AMD’s Helios Rackscale AI platform. The companies plan to show an initial look at the open-source solution at the OCP Global Summit in San Jose, Oct. 12-16, 2026.

1. Cooling collaboration

nVent Electric will add its rear-door heat exchanger cooling to the Helios platform to support high-density AI deployments. Its DC-powered dual rear-door unit targets the double-wide Helios rack and is designed to capture residual heat from liquid cooling.

nVent partners with AMD to add rack-level cooling to Helios AI platform

1. Cooling collaboration

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