Samsung, Broadcom sign MOU to expand memory and foundry collaboration for AI chips
AVGO•Samsung and Broadcom expand AI chip collaboration
Samsung Electronics said it signed an MOU with Broadcom to expand collaboration across memory and foundry for next-generation AI infrastructure.
The companies projected more than $200 billion of combined memory and foundry collaboration over the next five years through 2030.
Deal scope includes HBM, advanced nodes and packaging
The deal scope includes HBM supply for Broadcom AI accelerators, Samsung 2-nm and below foundry work, supported by advanced packaging.
