Samsung says HBM to account for nearly 30% of industry DRAM capacity next year
Samsung Electronics expects high-bandwidth memory (HBM) to account for nearly 30% of DRAM makers’ total wafer capacity next year, up from about 20% currently.
1. HBM capacity share
Samsung Electronics Executive Vice President Kim Taewoo said HBM is expected to account for nearly 30% of DRAM makers’ total wafer capacity next year, compared with about 20% currently. HBM and standard DRAM compete for the same wafer capacity, so expanding HBM output could constrain standard DRAM supply.
