Schmid Group presents AI-driven advanced packaging growth strategy
SHMD•Schmid Group expects advanced packaging demand to drive growth, with substrate capacity falling short from 2027. Substrate prices have risen 20%, while package substrates are projected to grow about 15%.
1. Packaging market outlook
Schmid Group expects advanced packaging demand to drive growth, with substrate capacity falling short from 2027. Manufacturers are pulling forward long-lead equipment orders for production lines planned for 2027-2028, and substrate prices have risen 20% so far. The overall market is projected to grow at an 8% compound annual rate, while package substrates are expected to grow about 15%.
2. Emerging technologies
Panel-level packaging remains at an early stage, with production volumes expected from late 2026 at ASE and in 2027-2028 at PTI and TSMC. Glass-core projects have slipped to 2027-2030; Schmid targets differentiation through integrated through-glass-via processing and seedless bottom-up filling.
