- The plan includes an advanced packaging **R&D testbed** designed to speed prototyping with customers, universities and partners. - Project outlook calls for about **1,000 on-site staff**, **7,000 direct and indirect jobs**, and more than **100 potential suppliers**. - SK hynix will invest over **$4 billion** to build an AI-memory advanced packaging facility in **West Lafayette, Indiana**. - Cleanroom opening is targeted for **October 2028**, with mass production of next-generation **HBM** slated for the **second half of 2029**. - The site will be the company’s first **US HBM production base**; wafers made in South Korea will be packaged and tested in Indiana for US customers.
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