Sony and TSMC to Invest 1 Trillion Yen in Japan Image Sensor JV
SONY•Sony and TSMC will invest 1 trillion yen to establish a joint venture in Kumamoto Prefecture that will start producing next-generation stacked CMOS image sensors for automotive ADAS and consumer electronics by FY2029. The facility aims to deliver capacity of 200,000 wafers per month to meet growing sensor demand.
1. Joint Venture Formation and Investment
Sony and TSMC have agreed to form a new joint venture in Kumamoto Prefecture, Japan, committing a combined 1 trillion yen of investment. The JV structure grants Sony a majority stake, with TSMC providing advanced fabrication expertise to accelerate sensor development.
2. Facility Timeline and Capacity
Construction of the wafer fab is scheduled to commence in late 2026, with mass production of stacked CMOS image sensors targeted by the end of FY2029. Once operational, the facility will ramp to 200,000 wafers per month to address surging demand across multiple end markets.
3. Product Focus and Market Implications
The JV will focus on high-performance image sensors for automotive advanced driver-assistance systems, smartphones and emerging AR/VR applications. By localizing production, Sony aims to strengthen its sensor leadership, improve supply stability and capture higher margins in the evolving sensor market.
