South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment
President Lee Jae Myung said Samsung Electronics' 6 trillion won ($4.48 billion) investment in a high-bandwidth memory chip packaging plant in Asan would be followed by about 40 trillion won in advanced-equipment investment.
1. Planned equipment investment
South Korean President Lee Jae Myung said Samsung Electronics' 6 trillion won ($4.48 billion) investment in a high-bandwidth memory chip packaging plant in Asan, South Korea, would be followed by about 40 trillion won in investment in advanced equipment.
