STMicroelectronics Launches 800G/1.6T PIC100 Production, Plans 4x Capacity by 2027
STMicroelectronics has started high-volume production of its PIC100 silicon photonics platform on 300 mm lines, delivering 800G and 1.6T transceivers to leading hyperscalers. The company plans to more than quadruple production capacity by 2027 and introduce a TSV-enabled PIC100 variant for denser optics integration.
1. High-Volume PIC100 Production
STMicroelectronics has commenced high-volume production of its PIC100 silicon photonics platform using 300 mm manufacturing lines. The 800G and 1.6T transceivers deliver higher bandwidth, lower latency, and improved energy efficiency for hyperscaler data centers and AI clusters.
2. Capacity Expansion Plan
The company has secured long-term capacity reservations from hyperscalers and aims to quadruple production output by 2027, with additional expansion slated for 2028. This aggressive ramp is designed to meet surging AI infrastructure demand and ensure secure, predictable supply.
3. Market Growth and Forecast
The data center pluggable optics market reached $15.5 billion in 2025 and is projected to grow at a 17% CAGR to exceed $34 billion by 2030. Co-packaged optics are expected to generate over $9 billion in revenue by 2030, while silicon photonics transceiver share should rise from 43% to 76% over the same period.
4. TSV-Enabled PIC100 Roadmap
Parallel to high-volume production, STMicroelectronics is developing a TSV-enabled PIC100 platform to boost optical connectivity density, module integration, and thermal efficiency. This next-generation technology will support near-packaged and co-packaged optics for deeper optical–electronic integration.