Taiwan breaks ground on advanced packaging park anchored by TSMC

"With the rapid development of AI and high-performance computing, advanced packaging has become a critical part of global semiconductor competition," Taiwan President Lai Ching-te said at the ceremony.

Lai said the park would allow key equipment and materials suppliers to conduct research, testing and validation at the site, shortening the time needed to bring new technologies into mass production and helping local companies enter the advanced chipmaking supply chain.

The Baipu Industrial Park will serve as a testing and validation hub for equipment and materials used in TSMC's advanced packaging, an increasingly important technology for producing powerful artificial intelligence chips.

TSMC's advanced packaging technology is used to produce advanced AI chips designed by Nvidia, Advanced Micro Devices and Broadcom.