TI Unveils 10–1200 TOPS SoCs, 4D Radar and PoDL Ethernet PHY
Texas Instruments introduced three automotive chips: the TDA5 SoC family delivering 10–1200 TOPS for SAE Level 3 autonomy, the AWR2188 4D radar transceiver with >350 m range, and the DP83TD555J-Q1 10BASE-T1S Ethernet PHY with Power over Data Line. These chips simplify ADAS and enable edge AI processing in software-defined vehicles.
1. Q4 2025 Earnings Webcast Scheduled for Jan. 27
Texas Instruments will host its fourth-quarter and full-year 2025 earnings conference call on Tuesday, Jan. 27 at 3:30 p.m. Central time. Chairman, President and CEO Haviv Ilan, CFO Rafael Lizardi and VP of Investor Relations Mike Beckman will review financial results and take questions. The live audio webcast will be available on TI’s Investor Relations website, with an archived replay posted shortly after the call. This event will mark the first public disclosure of TI’s quarterly revenue mix by end market, gross margin trajectory and free cash flow conversion for 2025—key metrics for dividend sustainability and capital return planning.
2. Automotive Semiconductor Portfolio Drives Edge AI Leadership
At CES 2026, TI unveiled its TDA5 family of compute-optimized SoCs delivering between 10 and 1,200 TOPS of edge AI performance at better than 24 TOPS/W, powered by its next-generation C7 NPU. The chiplet-ready design supports up to SAE Level 3 autonomy and integrates Arm Cortex-A720AE cores, enabling cross-domain fusion of ADAS, infotainment and gateway functions on a single device compliant with ASIL D standards. Concurrently, TI introduced its AWR2188 eight-by-eight 4D imaging radar transceiver, capable of detecting objects over 350 meters with 30% faster chirp processing, and the DP83TD555J-Q1 10BASE-T1S Ethernet PHY for sub-nanosecond time sync and Power-over-Data-Line at edge nodes. These launches position TI to capture a larger share of the software-defined vehicle market, estimated to grow to over $70 billion in semiconductors by 2028.
3. Secure IoT Collaboration with Afero Expands TAM in Smart Home and Industrial
TI partnered with Afero to integrate its new CC3501E and CC3551E Wi-Fi® microcontrollers—supporting multi-band Wi-Fi 6 and Bluetooth 5.4 with embedded hardware security—into Afero’s enterprise-grade IoT platform. The collaboration aims to address a projected $35 billion IoT security market by 2027 through a U.S.-sourced supply chain. Demonstrations at CES highlight a developer program offering end-to-end encrypted sessions on microcontroller-class devices and a patented pairing-free onboarding workflow. By combining TI’s reliable manufacturing footprint with Afero’s VPN-grade security, TI expects to accelerate adoption in personal electronics, industrial automation and enterprise systems, driving analog and embedded processor revenue growth outside traditional semiconductor markets.