Texas Instruments Unveils 800VDC Architecture with 97.6% Efficiency for AI Data Centers
Texas Instruments unveiled a complete 800VDC power architecture with only two conversion stages from 800V to GPU core power and a GaN-based bus converter achieving 97.6% peak efficiency and over 2000W/in³ density. The solution, including 800V hot-swap protection and a 6V-to-sub-1V multiphase buck converter, debuts at NVIDIA GTC March 16-19.
1. Two-Stage 800VDC Power Architecture
Texas Instruments’ design reduces conversion stages to just two: a compact GaN-based 800V-to-6V isolated bus converter followed by a high-current 6V-to-sub-1V multiphase buck stage, streamlining the path from high-voltage input to GPU core power.
2. Industry-Leading Efficiency and Power Density
Integration of GaN power stages delivers a peak efficiency of 97.6% and power density exceeding 2000W per cubic inch, enabling data center operators to maximize rack-level computing density while minimizing energy losses.
3. Product Showcase at NVIDIA GTC
The complete solution, including an 800V hot-swap controller, multiphase buck converter, 30kW AC/DC power supply and 800V capacitor bank units, will be demonstrated at NVIDIA GTC March 16-19 to highlight scalability for future AI data centers.