TI partners with Afero on secure IoT MCUs and unveils 1200 TOPS TDA5 SoCs
Texas Instruments and Afero launched TI’s first Wi-Fi microcontrollers with Afero’s secure IoT platform for U.S.-sourced, end-to-end encrypted smart home connectivity. TI also unveiled TDA5 SoCs delivering up to 1200 TOPS via a proprietary NPU and AWR2188 eight-by-eight 4D imaging radar transceivers, targeting Level 3 vehicle autonomy.
1. TXN Strengthens Position as a Pure AI Infrastructure Play
Texas Instruments’ core analog and embedded-processing business is becoming one of the purest plays on the AI infrastructure trend. Analog chips—components that convert real-world signals into data—drive roughly two-thirds of TI’s annual revenue, and management noted this week that AI features are rapidly being integrated into its key end markets: automotive, defense electronics and robotics. Industry data show that by 2025, 75% of enterprise-generated data will be processed at the edge rather than centralized data centers (Gartner), creating demand for TI’s edge-optimized devices. In its latest product cycle, TI has ramped high-volume production of chiplet-ready SoCs capable of delivering up to 1 200 TOPS of AI performance with better than 24 TOPS/W power efficiency, positioning the company to capture a growing share of both data-center offload and edge-AI workloads.
2. Partnership with Afero Delivers Secure, U.S.-Sourced IoT Platform
TI this week announced a collaboration with Afero to integrate its first Wi-Fi microcontrollers—the CC3501E and CC3551E supporting multi-band Wi-Fi 6 and Bluetooth 5.4—with Afero’s enterprise-grade secure IoT software. The joint platform provides hardware roots of trust plus over-the-top, end-to-end encrypted sessions that create VPN-grade security on microcontroller-class devices. Afero powers a leading home-improvement retailer’s smart-home platform used in millions of U.S. households, and TI factories in Texas and Oregon will supply the complete solution. Engineers can evaluate the combined offering through TI’s developer program, accelerating adoption in industrial, enterprise and consumer categories and leveraging Afero’s footprint across 200 product categories from more than 50 manufacturers.
3. Expanded Automotive Portfolio Accelerates Path to Autonomous Vehicles
At CES 2026, TI unveiled its TDA5 family of system-on-chips for automotive, delivering edge AI performance from 10 TOPS up to 1 200 TOPS via a proprietary neural processing unit and Universal Chiplet Interconnect Express interface. These SoCs support up to SAE Level 3 autonomy with a power-and-safety-optimized architecture that achieves more than 24 TOPS/W and meets ASIL D safety standards without external components. TI also introduced the AWR2188, a single-chip eight-by-eight 4D imaging radar transceiver that integrates transmitters and receivers to simplify high-resolution radar designs and offers 30% faster analog-to-digital conversion and signal-processing performance, detecting objects beyond 350 meters. Finally, the DP83TD555J-Q1 10BASE-T1S Ethernet PHY extends high-performance Ethernet to vehicle edge nodes with Power-over-Data-Line capability, reducing wiring complexity and cost.