TI Unveils IsoShield Modules With 3× Power Density and 70% Smaller Size
Texas Instruments launched UCC34141-Q1 and UCC33420 isolated power modules using proprietary IsoShield technology, achieving up to three times higher power density and shrinking solution size by as much as 70%. They expand TI’s 350+ module lineup and support efficiency and compact designs in data centers and EVs.
1. Product Introduction
Texas Instruments introduced two isolated power modules, the UCC34141-Q1 (6V–20V) and UCC33420 (5V), featuring proprietary IsoShield multichip packaging. These modules integrate a high-performance planar transformer and isolated power stage, delivering up to 2W of power in packages as small as 4mm×5mm×1mm.
2. Technical Advantages
IsoShield technology achieves up to three times higher power density than discrete solutions and shrinks overall solution size by as much as 70%, while providing functional, basic and reinforced isolation. The copackaged design supports distributed power architectures, reduces material costs and accelerates design cycles by simplifying layout and safety compliance.
3. Applications and Availability
The new modules target space-constrained, high-efficiency applications in data centers and electric vehicles, enabling compact, reliable power rails and traction inverter designs. Preproduction and production quantities, along with evaluation modules, reference designs and simulation models, are available now on TI.com.