Tower and Scintil Debut DWDM Lasers for $200 B AI Networking Market
Tower Semiconductor and Scintil Photonics introduced the first heterogeneously integrated DWDM laser sources for AI infrastructure, combining Scintil’s SHIP™ platform with Tower’s silicon photonics manufacturing for millions of units per month. The collaboration targets hyperscale Co-Packaged Optics deployments to tap into an AI networking market forecast at $200 billion by 2030.
1. Product Launch
Tower Semiconductor and Scintil Photonics introduced the world’s first heterogeneously integrated DWDM laser sources for AI infrastructure. The partnership integrates Scintil’s SHIP™ heterogeneous photonics with Tower’s silicon photonics platform, enabling co-packaged optics (CPO) applications requiring high bandwidth density and ultra-low latency.
2. Technology Details
Scintil’s SHIP™ technology monolithically integrates active laser sources with established silicon photonics on a single chip. The LEAF Light™ devices meet demanding Dense Wavelength Division Multiplexing requirements and are validated for high-volume hyperscale CPO programs.
3. Market Opportunity
The collaboration targets the scale-up networking segment of AI infrastructure, projected to consume an increasing share of a $200 billion AI networking market by 2030. DWDM CPO solutions offer lower energy per bit, improved GPU utilization, and expanded bandwidth for next-generation GPU clusters.
4. Manufacturing and Deployment
Tower Semiconductor’s multi-site silicon photonics manufacturing footprint spans Israel, the U.S., Japan, and Italy, providing resilient capacity and supply continuity. The partnership establishes a defined path from customer evaluation to volume production of millions of laser units per month.