Tower Semi, NewPhotonics start high-volume shipments of laser-integrated optical engine PICs for AI interconnects
TSEM•Tower Semiconductor and NewPhotonics begin high-volume shipments
Tower Semiconductor partnered with NewPhotonics to begin high-volume shipments of laser-integrated, serviceable optical-engine photonic ICs for AI interconnect.
Production devices support 800G to 1.6T data rates, targeting external pluggable transceivers, extra-dense packaged optics, and near-packaged optics sockets.
The collaboration uses Tower’s PH18DA silicon photonics platform with heterogeneously integrated InP, enabling monolithic laser integration to improve yield, reliability, and ramp speed.
NewPhotonics’ CPX-MSA compliant 6.4T NPC505 chipsets are slated to enter volume shipments in 1H27.
