Taiwan Semiconductor Manufacturing Company reported on Saturday that a limited number of its production and research buildings within the Hsinchu Science Park were temporarily evacuated after seismic sensors registered ground motion exceeding the firm’s predefined safety thresholds. The company indicated that all affected areas underwent immediate structural inspections by its internal engineering teams and independent specialists, with no significant damage detected. Production lines in other parts of the campus continued running at full capacity, and normal operations in the evacuated facilities resumed by Sunday afternoon following clearance from safety authorities. TSMC emphasized that it will conduct a comprehensive review of its earthquake-response protocols and reinforce its monitoring systems to ensure minimal disruption to its global manufacturing network.