TSMC Fabricates Seven India DLI-Backed Startup Chips on Advanced Nodes
Taiwan Semiconductor Manufacturing Co. fabricated seven chip designs from India’s design-linked incentive startups, including advanced process nodes. These tape-outs under India’s ₹10,000 crore DLI scheme represent its first high-node outputs and could drive incremental wafer orders for TSMC.
1. Fabrication of DLI-Backed Startup Designs
TSMC successfully fabricated seven distinct chip designs from Indian startups benefiting from the government’s design-linked incentive scheme. The projects included advanced nodes, marking India’s first high-node tape-outs at an overseas foundry, and covering applications from IoT to high-performance computing.
2. Strategic and Commercial Implications
The completion of these tape-outs under a ₹10,000 crore incentive scheme underscores growing demand for high-end manufacturing services from emerging markets. This move could open new wafer order streams for TSMC and accelerate India’s ambition to develop a domestic semiconductor ecosystem.