UPM showcases starch-based paper packaging at PACK EXPO

INGR•2026-10-20

UPM will showcase paper-based packaging developed with Ingredion and Paramelt at PACK EXPO in Chicago, October 18-21. The packaging structure passed Part 1 recyclability testing at Western Michigan University.

1. Packaging showcase

UPM will showcase paper-based packaging developed with Ingredion and Paramelt at PACK EXPO in Chicago from October 18 to 21. The jointly developed packaging structure passed Part 1 recyclability testing at Western Michigan University.

Sources

UPM showcases starch-based paper packaging at PACK EXPO

Publicnow

UPM showcases starch-based paper packaging at PACK EXPO

1. Packaging showcase

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UPM showcases starch-based paper packaging at PACK EXPO

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