Amazon will add a second chip packaging line in its Taiwan facility, boosting AI device chip output by 40% to support next-gen Echo and Fire TV hardware. The move aims to reduce reliance on external vendors, cut procurement costs by roughly 30%, and improve on-device inference latency by over 50%.
Amazon is installing a second packaging line at its Taiwan chip facility, increasing wafer throughput to meet rising demand for on-device AI. This expansion is projected to lift chip output by 40%, translating to roughly 3 million inference chips per quarter by year-end.
The new chips will power upcoming Echo and Fire TV models with built-in neural processing units, enabling tasks like speech recognition and image analysis directly on the device. Amazon expects inference latency to drop by more than 50%, enhancing real-time responsiveness.
By scaling its in-house chip production, Amazon plans to trim third-party procurement expenses by about 30% and secure greater supply-chain control. This shift reduces dependence on external foundries and strengthens gross margin resilience for its hardware segment.
Amazon’s move mirrors competitors such as Google’s Tensor chips and Apple’s Neural Engines, positioning the company for deeper integration of AI across its device portfolio. Investors will monitor whether this vertical integration drives market share gains in the smart home and streaming hardware markets.
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