AMD and Samsung Sign MoU for HBM4, DDR5 Supplies and Foundry Talks
AMD and Samsung Electronics signed an MoU to supply Samsung’s HBM4 memory for AMD’s Instinct MI455X AI accelerators and DDR5 chips for sixth-generation EPYC processors. They will explore foundry manufacturing ties after AMD CEO Lisa Su toured Samsung’s Pyeongtaek chip plant to discuss expanding cooperation.
1. MoU for Memory Supplies
AMD and Samsung Electronics have formalized a memorandum of understanding under which Samsung will become a key supplier of next-generation HBM4 modules for AMD’s upcoming Instinct MI455X AI accelerators and optimized DDR5 memory for AMD’s sixth-generation EPYC server processors, reinforcing AMD’s AI infrastructure capabilities.
2. Foundry Partnership Talks
The agreement includes discussions on a foundry manufacturing partnership, with AMD CEO Lisa Su touring Samsung’s Pyeongtaek plant and meeting chip division chief Jun Young-hyun and Foundry Business head Han Jin-man to explore contract chip production for future AMD products beyond memory components.