AMD Commits $10 Billion to Expand Taiwan Packaging for Next-Gen CPUs and GPUs
AMD•AMD will invest over $10 billion in Taiwan with ASE Technology, Powertech Technology, Sanmina and Inventec to expand 2.5D and panel-based packaging capacity for 6th-Gen EPYC CPUs and Instinct MI450X GPUs. CEO Lisa Su says the upgrades will drive Helios rack-scale systems toward multi-gigawatt deployments in H2 2026.
1. Investment Overview
AMD will invest more than $10 billion across Taiwan’s semiconductor ecosystem, partnering with ASE Technology, Powertech Technology, Sanmina and Inventec to bolster local packaging capacity in a key global chip hub.
2. Packaging Technology Focus
The funding is aimed at scaling 2.5D and panel-based packaging architectures, including Elevated Fanout Bridge technology, to enhance interconnect bandwidth and power efficiency for its 6th-Gen EPYC processors and Instinct MI450X GPUs.
3. Deployment Timeline and Impact
These packaging upgrades are designed to support Helios rack-scale systems, with multi-gigawatt deployments slated for the second half of 2026 as AMD seeks to translate surging AI compute demand into stronger supply capacity and competitive footing.
